US Patent Issued to Lumileds Singapore on Feb. 10 for "Low Z-height LED array package having TSV support structure" (California Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,788, issued on Feb. 10, was assigned to Lumileds Singapore Pte. Ltd. (Singapore).

"Low Z-height LED array package having TSV support structure" was invented by Tze Yang Hin (Cupertino, Calif.), Erik Young (San Jose, Calif.), Kentaro Shimizu (Sunnyvale, Calif.), Grigoriy Basin (San Francisco), Emma Dohner (Menlo Park, Calif.) and Brendan Jude Moran (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure for a light emitter pixel array includes a plurality of pixels, with at least some pixels laterally separated from each other with a pixel light confinement structure. An inorganic substrate having a top redistribution l...