US Patent Issued to Logitech Europe on May 13 for "Low profile acoustic module" (Taiwanese, American Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,051, issued on May 13, was assigned to Logitech Europe S.A. (Lausanne, Switzerland).

"Low profile acoustic module" was invented by Daniel Ryan Marquez (Vancouver, Wash.), WeiJen Cheng (Zhubei, Taiwan) and Hungl Wu (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A low profile acoustic module is described. Embodiments include a headset acoustic module having first and second chambers. The first chamber has a side wall and first portion of a back wall, and defining a first volume. The side wall defines an opening sized to retain a speaker, and the first chamber defines a first volume. The second chamber is adjacent the first chamber,...