US Patent Issued to LITE-ON TECHNOLOGY on April 14 for "Light emitting package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,579, issued on April 14, was assigned to LITE-ON TECHNOLOGY Corp. (Taipei, Taiwan).

"Light emitting package structure" was invented by Wei-Chien Hung (Taipei, Taiwan), Chien-Tung Huang (Taipei, Taiwan), Hou-Chuan Tsai (Taipei, Taiwan) and Wei-Hsun Hsu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light emitting package structure includes a light emitting unit, a reflective layer, a reflective element and an optical layer. The light emitting unit has a top surface, a bottom surface and sidewall surfaces. The bottom surface and the top surface are opposing to each other. The sidewall surfaces are between the top surface and the bot...