US Patent Issued to LINTEC on June 9 for "Substrate for release sheets, and release sheet" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,649,870, issued on June 9, was assigned to LINTEC Corp. (Itabashi-ku, Japan).

"Substrate for release sheets, and release sheet" was invented by Koji Tsuchibuchi (Itabashi-ku, Japan) and Kiichiro Kato (Itabashi-ku, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate may be suitable for release sheet and may include, in this order, a support, an adhesion layer (X1), and a resin layer (Y1) containing polyethylene having a density of 930 kg/m3 or more and 960 kg/m3 or less, wherein convex portions are present on the surface of the resin layer (Y1). A difference in height of the convex portions may be 0.5 micro metre or more."

The patent was fil...