US Patent Issued to LIDS SEMICONDUCTOR TECHNOLOGY on Nov. 3 for "Wafer stage lifting system and method for raising a wafer stage" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,832, issued on Nov. 3, was assigned to LIDS SEMICONDUCTOR TECHNOLOGY Co. LTD. (Taichung City, Taiwan).

"Wafer stage lifting system and method for raising a wafer stage" was invented by Chun-Jung Chiu (Taichung City, Taiwan), Chun-Hsiung Chen (Taichung City, Taiwan) and Wen-Tung Yang (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a system and method for precisely aligning a wafer and a photomask in a semiconductor lithography process. The system includes a wafer stage, a photomask stage, multiple linear actuators and distance sensors, and a controller. The wafer stage is configured to carry a waf...