US Patent Issued to LG INNOTEK on March 31 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,404, issued on March 31, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package comprising same" was invented by Se Woong Na (Seoul, South Korea), Sang Il Kim (Seoul, South Korea) and Kee Han Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes an insulating layer; a circuit pattern layer including a first metal layer disposed on the insulating layer; a protective layer disposed on the insulating layer, vertically overlapping the first metal layer, and including a recess portion having a step in a horizontal direction; and a second meta...