US Patent Issued to LG INNOTEK on Jan. 20 for "Smart IC substrate, smart IC module, and IC card including the same" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,558, issued on Jan. 20, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Smart IC substrate, smart IC module, and IC card including the same" was invented by Seung Joon Kim (Seoul, South Korea), Jun Young Lim (Seoul, South Korea) and Yong Hyun Cho (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is elec...