US Patent Issued to LG Energy Solution on July 14 for "Non-destructive wire bonding inspection method" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,682,446, issued on July 14, was assigned to LG Energy Solution Ltd. (Seoul, South Korea).

"Non-destructive wire bonding inspection method" was invented by Seok Won Jeung (Daejeon, South Korea), Hyun Min Oh (Daejeon, South Korea), Geon Tae Park (Daejeon, South Korea) and Choon Kwon Kang (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A non-destructive wire bonding inspection method is provided to inspect whether a wire bonding applied to a battery system is defective. The method includes a) photographing a wire bonding portion using a camera, b) calculating the area of the wire bonding portion, and c) determining whether the wire bon...