US Patent Issued to LG Electronics on June 30 for "Thermocompression device and method of manufacturing display device using same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,417, issued on June 30, was assigned to LG Electronics Inc. (Seoul, South Korea).

"Thermocompression device and method of manufacturing display device using same" was invented by Eunjeong Kang (Seoul, South Korea) and Byungjoon Rhee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment, a thermocompression device for thermally compressing a semiconductor light emitting element array onto a wiring board may comprise: a lower head that supports the wiring board; an upper head that moves a donor including the semiconductor light emitting element array, and presses the semiconductor light emitting element array ag...