ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,448, issued on Sept. 22, was assigned to LG CHEM Ltd. (Seoul, South Korea).
"Encapsulation film" was invented by Yeong Bong Mok (Daejeon, South Korea), Seung Min Lee (Daejeon, South Korea), Sang Min Park (Daejeon, South Korea), Sung Nam Moon (Daejeon, South Korea) and Se Woo Yang (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same are provided, where the encapsulation film allows forming a structure capable of blocking moisture or oxygen penetrating...