US Patent Issued to LG CHEM on May 12 for "Thermoplastic resin composition, method of preparing the same, and molded article manufactured using the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,202, issued on May 12, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Thermoplastic resin composition, method of preparing the same, and molded article manufactured using the same" was invented by Eunji Lee (Daejeon, South Korea), Bong Keun Ahn (Daejeon, South Korea), Min Jung Kim (Daejeon, South Korea), Jangwon Park (Daejeon, South Korea), Jiyoon Jeon (Daejeon, South Korea) and Seyong Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermoplastic resin composition including an alkyl (meth)acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A) including a polymer seed including 70 to 85% by weight o...