ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,691, issued on June 30, was assigned to LG Chem Ltd. (Seoul, South Korea).
"Thermoplastic resin composition" was invented by Hyun Mo Lee (Daejeon, South Korea), Seul Ki Im (Daejeon, South Korea), Ji Hyun Park (Daejeon, South Korea), Yun Kon Kim (Daejeon, South Korea), Seung Jung Yu (Daejeon, South Korea), Seok Pil Sa (Daejeon, South Korea), Ki Soo Lee (Daejeon, South Korea) and Eun Ji Shin (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a thermoplastic resin composition including a polyolefin-polystyrene-based multi-block copolymer having a structure in which a polystyrene chain is attached to bo...