ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,349, issued on July 28, was assigned to LG CHEM Ltd. (Seoul, South Korea).
"Substrate for heat-resistant electronic device" was invented by Youngsun Park (Tokyo) and Shinji Shiraki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure proposes an improved heat resistant base for electronic equipment having transparency, heat resistance and mechanical strength and also having superior optical properties and quality, and thereby capable of replacing a transparent glass base. The present disclosure is accomplished by the heat resistant base for electronic equipment including a polyimide-based resin and a hollow particle, wherein ...