US Patent Issued to LG Chem on Jan. 27 for "Encapsulation film, organic electronic element comprising the same, and method for manufacturing thereof" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,649, issued on Jan. 27, was assigned to LG Chem Ltd. (Seoul, South Korea).

"Encapsulation film, organic electronic element comprising the same, and method for manufacturing thereof" was invented by Sung Nam Moon (Daejeon, South Korea), Seung Min Lee (Daejeon, South Korea), Eun Jeong Kim (Daejeon, South Korea), Yeong Bong Mok (Daejeon, South Korea), Se Woo Yang (Daejeon, South Korea) and Jun Won Choi (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, an...