US Patent Issued to LG CHEM on Feb. 17 for "Thermoplastic resin composition, method of preparing the same, and molded article including the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,927, issued on Feb. 17, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Thermoplastic resin composition, method of preparing the same, and molded article including the same" was invented by Seonho Kong (Daejeon, South Korea), Gun Ko (Daejeon, South Korea) and Sun Mo Son (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thermoplastic resin composition, a method of preparing the same, and a molded article including the same. The composition includes 35 to 50 wt % of a polybutylene terephthalate resin (A) having an intrinsic viscosity of 0.6 to 0.9 dl/g; 5 to 15 wt % of a polyethylene terephthalate homopolymer (B); ...