US Patent Issued to LEXTAR ELECTRONICS on March 24 for "Package structure and forming method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,324, issued on March 24, was assigned to LEXTAR ELECTRONICS Corp. (Hsinchu, Taiwan).

"Package structure and forming method thereof" was invented by Kang-Hung Liu (Hsinchu, Taiwan), Chih-Hao Lin (Hsinchu, Taiwan) and Shiou-Yi Kuo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure has a light-emitting region and a non-light-emitting region that is adjacent to the light-emitting region, and includes a substrate, a first light-emitting layer, a second light-emitting layer and a third light-emitting layer. The first light-emitting layer, the second light-emitting layer and the third lig...