ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,130, issued on Feb. 17, was assigned to Levitech B.V. (Almere, Netherlands).
"Multi-chamber apparatus and method for ALD" was invented by Vladimir Kuznetsov (Almere, Netherlands), Jacobus Hubertus Maria Beijersbergen (Almere, Netherlands) and Simon Cornelis Van Der Linde (Houten, Netherlands).
According to the abstract* released by the U.S. Patent & Trademark Office: "An atomic layer deposition apparatus comprising a first single substrate process chamber, a second single substrate process chamber, and a transfer mechanism configured to transfer the substrate between the first and the second process chamber. Wherein both the first and second single substrate process chambers are ...