US Patent Issued to Lenovo Enterprise Solutions (Singapore) on May 5 for "Heat dissipation system and method for electronic devices" (Singaporean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,960, issued on May 5, was assigned to Lenovo Enterprise Solutions (Singapore) Pte. Ltd. (Singapore).

"Heat dissipation system and method for electronic devices" was invented by Fwu-Bin Hsu (Singapore), Jeffrey Holland (Singapore), Vinod Kamath (Singapore), Wen-Lung Wang (Singapore), Cheng-Yao Cheng (Singapore) and Chih-Lynn Yeh (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present application provides a heat dissipation system and method for electronic devices. The system includes a heat dissipation unit attached to electronic component of an electronic device, a temperature and humidity sensor, a cooling unit and a controller. The con...