US Patent Issued to LENOVO (SINGAPORE) on Nov. 11 for "Heat radiation structure and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,813, issued on Nov. 11, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore).

"Heat radiation structure and electronic apparatus" was invented by Junki Hashiba (Yokohama, Japan), Takuroh Kamimura (Yokohama, Japan), Masahiro Kitamura (Yokohama, Japan) and Ryota Watanabe (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central po...