US Patent Issued to LENOVO (SINGAPORE) on July 21 for "Heat radiation structure, electronic apparatus, and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,169, issued on July 21, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore).

"Heat radiation structure, electronic apparatus, and method for manufacturing same" was invented by Masahiro Kitamura (Yokohama, Japan), Junki Hashiba (Yokohama, Japan), Takuroh Kamimura (Yokohama, Japan) and Ryota Watanabe (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat radiation structure includes a metal mesh brought into contact with the surface of a die, and a heat receiving plate configured to sandwich the mesh between the surface of the die and the heat receiving plate. The mesh is impregnated with a liquid metal at least at a portion brou...