US Patent Issued to LENOVO (SINGAPORE) on Feb. 17 for "Heat radiation structure, electronic device, and heat transfer structure" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,249, issued on Feb. 17, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore).

"Heat radiation structure, electronic device, and heat transfer structure" was invented by Masahiro Kitamura (Yokohama, Japan), Takuroh Kamimura (Yokohama, Japan), Ryota Watanabe (Yokohama, Japan) and Junki Hashiba (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat radiation structure includes a mesh that abuts on a surface of a die, and a vapor chamber that interposes the mesh between the surface of the die and the vapor chamber. The mesh includes a heat generation element abutting range portion that is provided at a central portion of the mesh, is...