ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,003, issued on Aug. 4, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore).
"Heat radiation component and electronic apparatus" was invented by Ryota Watanabe (Yokohama, Japan), Masahiro Kitamura (Yokohama, Japan), Junki Hashiba (Yokohama, Japan) and Takuroh Kamimura (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening ab...