US Patent Issued to LENOVO (SINGAPORE) on April 14 for "Connection structure and electronic substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,449, issued on April 14, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore).

"Connection structure and electronic substrate" was invented by Xueyong Yang (Yokohama, Japan) and Dante Eco Gomez (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A connection structure and an electronic substrate can prevent poor connection between a connector and a flat cable. On the electronic substrate of the connection structure, at a location where a connector is to be mounted, a Type 1 connector line is marked in an X1 direction, and a Type 2 connector line is marked in an X2 direction. A Type 1 cable line is marked so as to be partly exposed w...