US Patent Issued to LAYA TECHNOLOGY on June 2 for "Adhesive bonding method for the shoe making" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,642,335, issued on June 2, was assigned to LAYA TECHNOLOGY Co. LTD. (Douliu City, Taiwan).

"Adhesive bonding method for the shoe making" was invented by Wen-Chih Lin (Douliu City, Taiwan) and Li-Yung Hsu (Taichung City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive bonding method for the shoe making, which includes the following continuous operations: heating an electromagnetic polarized solid adhesive to melt it into glue; using a glue spraying device spray a thin layer of the melted adhesive glue to the surface of the shoe outsole; put a vamp (the bottom already includes the shoe midsole) onto the shoe outsole; fix the shoe vamp and...