US Patent Issued to LAPIS TECHNOLOGY on Aug. 25 for "Multi-die module, a power supply" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,719,369, issued on Aug. 25, was assigned to LAPIS TECHNOLOGY Co. LTD. (Yokohama, Japan).

"Multi-die module, a power supply" was invented by Yoshinori Yano (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-die module includes: a first semiconductor die having an internal line, an external electrode, and multiple internal electrodes and including a first control circuit that control a DC-DC converter; a second semiconductor die having multiple internal electrodes and including a second control circuit that controls a linear regulator; and a package that supports the first and second semiconductor dies. The second control circuit incl...