ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,588, issued on Oct. 14, was assigned to Lam Research Corp. (Fremont, Calif.).
"Method and apparatus for processing wafers" was invented by Ming Li (Fremont, Calif.), Benson Quyen Tong (San Jose, Calif.) and Chander Radhakrishnan (Pleasanton, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for providing plasma processing is provided. A plasma processing chamber is provided. A first turbopump with an inlet is in fluid connection with the plasma processing chamber and an exhaust. A gas source provides gas to the plasma processing chamber. At least one gas line is in fluid connection between the gas source and the plasma processing ch...