US Patent Issued to Lam Research on June 2 for "Substrate sticking and breakage mitigation" (Oregon, California Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,199, issued on June 2, was assigned to Lam Research Corp. (Fremont, Calif.).

"Substrate sticking and breakage mitigation" was invented by Aaron Berke (Portland, Ore.), John Floyd Ostrowski (Lake Oswego, Ore.), Santosh Kumar (Beaverton, Ore.), Boon Kang Ong (Beaverton, Ore.), Robert Rash (West Linn, Ore.), Ian Waller (Sherwood, Ore.), Lawrence Kingrey (Oregon City, Ore.) and Brett M. Herzig (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, the disclosed apparatus is a substrate contact-ring to support a substrate. The substrate contact-ring includes a peripheral structure sized and configured to support the substrate wit...