ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,718, issued on Jan. 20, was assigned to Lam Research Corp. (Fremont, Calif.).
"Improving substrate wettability for plating operations" was invented by Zhian He (Lake Oswego, Ore.), Shantinath Ghongadi (Tigard, Ore.), Hyungjun Hur (Tigard, Ore.), Ludan Huang (King City, Ore.), Jingbin Feng (Lake Oswego, Ore.), Douglas Hill (Tigard, Ore.), Thomas Burke (Newberg, Ore.), Manish Ranjan (Sherwood, Ore.) and Andrew James Pfau (Portland, Ore.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments include methods and apparatuses to moisturize a substrate prior to an electrochemical deposition process. In one embodiment, a method to control substr...