US Patent Issued to Lam Research on Feb. 10 for "Wafer edge deposition for wafer level packaging" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,687, issued on Feb. 10, was assigned to Lam Research Corp. (Fremont, Calif.).

"Wafer edge deposition for wafer level packaging" was invented by Xuefeng Hua (Foster City, Calif.), Jack Chen (San Francisco), Ian Scot Latchford (Palo Alto, Calif.), Chia-Shin Lin (Taipei, Taiwan) and Chanthavisa Keovisai (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor processing methods and apparatuses are provided. Some methods include providing a first wafer to a processing chamber, the first wafer having a thickness, a beveled edge, a first side, and a plurality of devices formed in a device area on the first side, the device area havin...