US Patent Issued to Lam Research on April 21 for "Chamfer-less via integration scheme" (California, Oregon Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,905, issued on April 21, was assigned to Lam Research Corp. (Fremont, Calif.).

"Chamfer-less via integration scheme" was invented by Sivananda Krishnan Kanakasabapathy (Pleasanton, Calif.), Hui-Jung Wu (Pleasanton, Calif.), Richard Wise (Los Gatos, Calif.) and Arpan Pravin Mahorowala (West Linn, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses for processing semiconductor substrates in an integration scheme to form chamferless vias are provided herein. Methods include bifurcating etching of dielectric by depositing a conformal removable sealant layer having properties for selective removal relative to dielectric material ...