US Patent Issued to LAM RESEARCH on April 14 for "High-speed 3D metal printing of semiconductor metal interconnects" (Oregon Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,080, issued on April 14, was assigned to LAM RESEARCH Corp. (Fremont, Calif.).

"High-speed 3D metal printing of semiconductor metal interconnects" was invented by Steven T. Mayer (Aurora, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for printing metal interconnects on a substrate includes an anode substrate. A plurality of anodes are arranged on one side of the anode substrate with a first predetermined gap between adjacent ones of the plurality of anodes. A first plurality of fluid holes have one end located between the plurality of anodes. A plurality of control devices is configured to selectively supply current to the plurality ...