US Patent Issued to Laird Technologies on Sept. 1 for "Low dielectric, low loss radome" (California, Ohio, Massachusetts Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,725,916, issued on Sept. 1, was assigned to Laird Technologies Inc. (Chesterfield, Mo.).

"Low dielectric, low loss radome" was invented by Hoang Dinh Do (Canton, Mass.), Richard N. Johnson (Encinitas, Calif.) and Douglas S. McBain (Wadsworth, Ohio).

According to the abstract* released by the U.S. Patent & Trademark Office: "A low dielectric, low loss radome comprising microspheres integrated into a matrix. The microspheres reduce overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome."

The patent was filed on Dec. 4, 2023, under Application No. 18/527,949.

*For further information, including images, charts and table...