ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,075, issued on Sept. 15, was assigned to Kyoritsu Die Cast Kakosho Co. Ltd. (Hyogo, Japan).
"Coupling structure and coupling device" was invented by Akira Sawada (Hyogo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A coupling device has a support groove that, in a state in which the coupling device is attached to a first shaft-shaped section, allows a member having a shaft shape to be inserted therein in a direction crossing the first shaft-shaped section. The coupling device can fix, to the support groove, a second shaft-shaped section of a tool such as a clamp, which is a supported object, by using a second direction fixing screw while th...