ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,082, issued on Feb. 17, was assigned to KYORAKU Co. LTD. (Kyoto, Japan).
"Resin residue removal device" was invented by Tadatoshi Tanji (Yamato, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin residue removal device is provided that is capable of appropriately removing a resin residue adhered to a lower surface of a die of a molding apparatus. The present invention provides a resin residue removal device for removing a resin residue adhered to a lower surface of a die of a molding apparatus, the device including a moving mechanism and a resin residue removal head, wherein the moving mechanism is configured to move the resin residue remo...