US Patent Issued to Kyocera on Nov. 3 for "Plasma-resistant laminate, manufacturing method therefor, and plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,785,048, issued on Nov. 3, was assigned to Kyocera Corp. (Kyoto, Japan).

"Plasma-resistant laminate, manufacturing method therefor, and plasma processing apparatus" was invented by Motohiro Umehara (Yasu, Japan), Wataru Fujita (Higashiomi, Japan) and Kazuhiro Ishikawa (Gamo-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A plasma-resistant laminate of the present disclosure includes a substrate, a membrane electrode formed on the substrate, and a dielectric layer formed on the membrane electrode, the substrate includes sapphire, the dielectric layer includes an oxide including yttrium, and the membrane electrode is made of an active metal, a co...