US Patent Issued to KYOCERA on June 16 for "Wiring board and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,079, issued on June 16, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Wiring board and electronic device" was invented by Kouichirou Sugai (Kyoto, Japan) and Shinya Higuchi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To sufficiently reduce transmission loss and noise of a signal. A signal wire is located on a first surface of an insulation substrate, a first ground and a second ground are located on the first surface of the insulation substrate with the signal wire interposed therebetween, a via conductor electrically connecting the first ground and the lower ground is located at least one of on a second surface of the insulation s...