US Patent Issued to KYOCERA on June 16 for "Housing package for electronic component" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. D1,130,113, issued on June 16, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Housing package for electronic component" was invented by Munehiro Uemura (Kyoto, Japan), Takeo Satake (Kyoto, Japan), Ryota Toshi (Kyoto, Japan), Norimasa Ueda (Kyoto, Japan) and Takuya Kitamura (Kyoto, Japan).

The patent was filed on July 31, 2023, under Application No. D/880,983.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1130113&OS=D1130113&RS=D1130113

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