US Patent Issued to KYOCERA on July 7 for "High-frequency board, high-frequency package, and high-frequency module" (Japanese Inventor)

ALEXANDRIA, Va., July 7 -- United States Patent no. RE50,947, issued on July 7, was assigned to KYOCERA Corp. (Kyoto, Japan).

"High-frequency board, high-frequency package, and high-frequency module" was invented by Yoshiki Kawazu (Higashiomi-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency board includes an insulating substrate, a first line conductor, and a second line conductor. The insulating substrate has an upper surface with a recess. The first line conductor is located on the upper surface of the insulating substrate. The second line conductor is located on the upper surface of the insulating substrate and extends parallel to the first line conductor with a space from the f...