US Patent Issued to KYOCERA on Feb. 10 for "Method for manufacturing semiconductor element, semiconductor element body, and semiconductor element substrate" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,674, issued on Feb. 10, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Method for manufacturing semiconductor element, semiconductor element body, and semiconductor element substrate" was invented by Katsuaki Masaki (Kyoto, Japan) and Masahiro Araki (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor element includes: forming a first semiconductor layer (SL1) and a second semiconductor layer (SL2) larger in thickness than the first semiconductor layer (SL1) on a mask layer (ML) including a first opening portion (K1) and a second opening portion (K2); forming a first device layer (DL1) and a seco...