ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,758, issued on May 26, was assigned to KYOCERA AVX Components Corp. (Fountain Inn, S.C.).
"Heat sink component with land grid array connections" was invented by Cory Nelson (Simpsonville, S.C.) and Marianne Berolini (Greer, S.C.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. The body can have a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces. The heat sink component also can include a heat source terminal formed over the bottom surface of the body. The heat source terminal can be spaced apart...