US Patent Issued to KV Innovations on April 7 for "Three-dimensional integrated circuit" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,993, issued on April 7, was assigned to KV Innovations LLC (Albuquerque, N.M.).

"Three-dimensional integrated circuit" was invented by Kambiz Vafai (Mission Viejo, Calif.) and Sainan Lu (Jurupa Valley, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional integrated circuit device can include a group of die, a device layer and a thermal interface material formed above the substrate. A heat spreader can be located above the die, the device layer and the thermal interface material. The heat spreader can include a heat pipe comprising a rectangular-shaped heat pipe or disk-shaped heat pipe. A heat sink can be located above the heat ...