US Patent Issued to KURARAY on March 24 for "Multilayer structure, packaging material in which same is utilized, regrind composition, and method for producing regrind composition" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,583,208, issued on March 24, was assigned to KURARAY Co. LTD. (Okayama, Japan).

"Multilayer structure, packaging material in which same is utilized, regrind composition, and method for producing regrind composition" was invented by Satoshi Ishiuchi (Kurashiki, Japan), Makoto Suzuki (Kurashiki, Japan), Minoru Okamoto (Kurashiki, Japan) and Yuriko Mizutani (Kurashiki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a multilayer structure having: a polyolefin layer (A); an adhesive resin layer (B); and a resin composition layer (C), wherein the polyolefin layer (A) is laminated on at least one face of the resin composi...