US Patent Issued to KURARAY on April 14 for "Multilayer structure and packaging material comprising same" (Japanese Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,542, issued on April 14, was assigned to KURARAY Co. LTD. (Okayama, Japan).

"Multilayer structure and packaging material comprising same" was invented by Makoto Suzuki (Kurashiki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a multilayer structure having a hard layer (A) and either a resin composition layer (B1) or a resin composition layer (B2), wherein the hard layer (A) has a puncture strength of 40 N/mm or more and 150 N/mm or less; the resin composition layer (B1) is made of a resin comprising an ethylene-vinyl alcohol copolymer (b1) having a melting point Tm1 of 170deg C. or more and an ethylene-vinyl alcohol copolym...