US Patent Issued to Kulicke and Soffa Industries on Sept. 15 for "Wire bonding systems, wire replacement systems, and related methods" (Singaporean, American Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,601, issued on Sept. 15, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).

"Wire bonding systems, wire replacement systems, and related methods" was invented by Wei Jing (Singapore), Kumar Manoj Venna (Singapore), Jianxu Ma (Singapore), Kay Soon Goh (Singapore), Wei Su (Singapore), Dong Zhang (Singapore) and Jesse S. Parish (North Wales, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wire bonding system is provided. The wire bonding system includes a bond head assembly configured to carry a wire bonding tool; and a wire replacement system configured to (i) remove a wire portion engaged with the wire bonding tool, the w...