ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,204, issued on Dec. 16, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.).
"Bonding systems for bonding of semiconductor elements to substrates including a gas composition analyzer, and related methods" was invented by Thomas J. Colosimo Jr. (Fort Washington, Pa.), Matthew B. Wasserman (Fort Washington, Pa.) and Adeel Bajwa (Fort Washington, Pa.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a bond head assembly for bonding a semiconductor element to a substrate at a bonding area of the bonding system; a reducing gas de...