ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,989, issued on March 3, was assigned to KUKA Systems North America LLC (Sterling Heights, Mich.).
"Transfer molding system and methods" was invented by Brian E. Connolly (Macomb, Mich.) and Corey Michael Buczek (Flushing, Mich.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A transfer molding system includes a plurality of resin receptacles selectively movable by a resin support into registration with a first actuator for dispensing resin material through a transfer manifold and into a component core. Two or more component cores are supported on a core support for selective movement to a position for receiving resin material dispensed through the ma...