US Patent Issued to KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE on Feb. 10 for "Catalyst ink for plating and electroless plating method using same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,799, issued on Feb. 10, was assigned to KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE (Changwon, South Korea).

"Catalyst ink for plating and electroless plating method using same" was invented by Seung Kwon Seol (Namyangju, South Korea), Sang Hyeon Lee (Gangneung, South Korea), Won Suk Chang (Seoul, South Korea) and Jae Yeon Pyo (Changwon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling...