US Patent Issued to Kokusai Electric on Nov. 3 for "Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,666, issued on Nov. 3, was assigned to Kokusai Electric Corp. (Tokyo).

"Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" was invented by Shoma Miyata (Toyama, Japan), Kimihiko Nakatani (Toyama, Japan), Takayuki Waseda (Toyama, Japan) and Yoshitomo Hashimoto (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes (a) forming a first adsorption-inhibiting layer by adsorbing at least a portion of a molecular structure of molecules constituting a first precursor on a surface of a first base by supplying the first precursor to a substrate includin...