US Patent Issued to KOKUSAI ELECTRIC on March 17 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,902, issued on March 17, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Atsushi Moriya (Toyama, Japan), Yukinori Aburatani (Toyama, Japan), Satoshi Takano (Toyama, Japan) and Naofumi Ohashi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique for suppressing interference between processes respectively performed in the plurality of reactors. According to one aspect thereof, a substrate processing apparatus includes: a first vessel including a transfer port and a p...