US Patent Issued to KOKUSAI ELECTRIC on July 7 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,235, issued on July 7, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Yuji Takebayashi (Toyama, Japan) and Kenji Ono (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: a process container in which a substrate is processed; a support configured to support the substrate in the process container; a gas flow controller configured to form a gas flow capable of making contact with the substrate in the process container; a first actuator configured to allow the support to reciprocate in...